Thermal and mechanical relaxation times play essential roles in the thermal quality factor $\left(Q-factor\right)$of the micro-resonators, where controls the energy damping through the coupling of thermal and mechanical behavior. In this work, we developed an analytical mathematical model that assumed a pre-stress in a two-temperature micro-viscothermoelastic resonator of silicon to modify the thermal and mechanical relaxation times and thus increase the thermal quality factor. The impacts of length-scale and pre-stress on the thermal quality factor have been discussed. The present model predicts that significant enhancement in terms of thermal quality factors is enabled by tuning the static-pre-stress, the thermal and mechanical relaxation times parameters. The isothermal value of frequency and the two-temperature parameter have impact effects on the thermal quality factor of the micro-resonators.

热和机械弛豫时间在热品质因数中起着至关重要的作用 $\left(问--F\mathrm{一种}CŤØ\mathrm{[R}\right)$微谐振器，通过热和机械行为的耦合来控制能量衰减。在这项工作中，我们开发了一个分析数学模型，该模型假设硅的两温微粘热弹性谐振器中存在预应力，以修改热和机械弛豫时间，从而提高热品质因数。讨论了长度尺度和预应力对热品质因数的影响。本模型预测，通过调整静态预应力，热和机械弛豫时间参数，可以显着提高热品质因数。频率的等温值和两个温度参数对微谐振器的热品质因数有影响。