This study aims to investigate the chromium (Cr) effects on the microstructural, mechanical and thermal properties of melt-spun Sn-3.5Ag alloy.,Ternary melt-spun Sn-Ag-Cr alloys were investigated using X-ray diffractions, scanning electron microscope, dynamic resonance technique, instron machine, Vickers hardness tester and differential scanning calorimetry.,The results revealed that the Ag3Sn intermetallic compound (IMC) and s-Sn have been refined because of the hard inclusions’ (Cr atoms) effects, causing lattice distortion increasing these alloys. The tensile results of Sn96.4-Ag3.5-Cr0.1 alloy showed an improvement in Young’s modulus more than 100 per cent (42.16 GPa), ultimate tensile strength (UTS) by 9.4 per cent (23.9 MPa), compared with the eutectic Sn-Ag alloy due to the high concentration of Ag3Sn and their uniform distribution. Shortage in the internal friction (Q−1) of about 54 per cent (45.1) and increase in Vickers hardness of about 7.4 per cent (142.1 MPa) were also noted. Hexagonal Ag3Sn formation led to low toughness values compared to the eutectic Sn-Ag alloy, which may have resulted from the mismatching among hexagonal Ag3Sn phase with orthorhombic Ag3Sn and s-Sn phases. Mechanically, the values of Young’s modulus have been increased, with increasing chromium content, whereas the UTS and toughness values have been decreased. The opposite of this trend appeared in Sn95.8-Ag3.5-Cr0.7 alloy, which may have been due to high lattice distortion (ƹ = 16.5 × 10−4) compared to the other alloys. Increase in the melting temperature Tm, ΔH, Cp and ΔT was because of Ag3Sn IMC formation. The low toughness of Sn96-Ag3.5-Cr0.5 and Sn95.8-Ag3.5-Cr0.7 (109.56 J/m3 and 35.66 J/m3), relatively high melting temperature Tm (223.22°C and 222.65°C) and low thermal conductivity and thermal diffusivity (32.651 w.m−1.k−1 and 0.314 m2/s) make them undesirable in the soldering process. The high UTS, high E, high thermal conductivity and diffusivity, low creep rate and low electrical resistivity, which have occurred with “0.1 Wt.%” of Cr, make this alloy desirable and reliable for soldering applications and electronic assembly.,This study provides chromium effects on the structure of the eutectic Sn-Ag rapidly solidified by melt-spinning technique. In this paper, the authors compared the elastic modulus of the melt-spun compositions, which have been resulted from the Static method with that have been resulted from the Dynamic method. This paper presents new improvements in mechanical and thermal performance.

中文翻译：

---

铬对快速凝固的共晶 Sn-Ag 合金的显微结构、机械和热性能的影响

本研究旨在研究铬 (Cr) 对熔纺 Sn-3.5Ag 合金显微组织、机械性能和热性能的影响。使用 X 射线衍射、扫描电子技术研究了三元熔纺 Sn-Ag-Cr 合金显微镜、动态共振技术、英斯特朗机、维氏硬度计和差示扫描量热法。 结果表明，Ag3Sn金属间化合物（IMC）和s-Sn由于硬夹杂物（Cr原子）的作用而被细化，导致晶格变形增加这些合金。Sn96.4-Ag3.5-Cr0.1 合金的拉伸结果表明，与 Sn96.4-Ag3.5-Cr0.1 合金相比，杨氏模量提高了 100% 以上 (42.16 GPa)，极限拉伸强度 (UTS) 提高了 9.4% (23.9 MPa)。由于 Ag3Sn 的高浓度和它们的均匀分布，共晶 Sn-Ag 合金。还注意到内摩擦 (Q-1) 减少了约 54% (45.1)，维氏硬度增加了约 7.4% (142.1 MPa)。与共晶 Sn-Ag 合金相比，六角形 Ag3Sn 的形成导致低韧性值，这可能是由于六角形 Ag3Sn 相与正交 Ag3Sn 和 s-Sn 相之间的不匹配造成的。在机械方面，杨氏模量值随着铬含量的增加而增加，而 UTS 和韧性值已经降低。与此趋势相反的情况出现在 Sn95.8-Ag3.5-Cr0.7 合金中，这可能是由于与其他合金相比的高晶格畸变 (ƹ = 16.5 × 10-4)。熔化温度 Tm、ΔH、Cp 和 ΔT 的增加是由于 Ag3Sn IMC 的形成。Sn96-Ag3.5-Cr0.5和Sn95.8-Ag3.5-Cr0.7的低韧性（109.56 J/m3和35.66 J/m3），相对较高的熔化温度 Tm（223.22°C 和 222.65°C）以及低导热率和热扩散率（32.651 wm-1.k-1 和 0.314 m2/s）使它们在焊接过程中不受欢迎。高 UTS、高 E、高热导率和扩散率、低蠕变率和低电阻率，这些都出现在“0.1 Wt.%”的 Cr 中，使这种合金成为焊接应用和电子组装的理想和可靠的合金。,本研究提供铬对通过熔体纺丝技术快速凝固的共晶 Sn-Ag 结构的影响。在本文中，作者比较了静态方法和动态方法产生的熔纺组合物的弹性模量。本文介绍了机械和热性能方面的新改进。