The purpose of this paper is to investigate the wettability and intermetallic (IMC) layer formation of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint according to the formulation of solder paste because of different types of fluxes.,Solder pastes were prepared by mixing SAC305 solder powder with different flux and different wt.% of carbon nanotube (CNT). Fourier transform infrared spectroscopy was used to identify functional groups from different fluxes of as-formulated solder paste. The solder pastes were then subjected to stencil printing and reflow process. Solderability was investigated via contact angle analysis and the thickness of cross-sectionally intermetallic layer.,It was found that different functional groups from different fluxes showed different physical behaviour, indicated by contact angle value and IMC layer thickness. “Aromatic contain” functional group lowering the contact angle while non-aromatic contain functional group lowering the thickness of IMC layer. The higher the CNT wt.%, the lower the contact angle and IMC layer thickness, regardless of different fluxes. Relationship between contact angle and IMC layer thickness is found to have distinguished region because of different fluxes. Thus it may be used as guidance in flux selection for solder paste formulation.,However, detail composition of the fluxes was not further explored for the scope of this paper.,The quality of solder joint of SAC305/CNT/Cu system, as indicated by contact angle and the thickness of IMC layer formation, depends on existence of functional group of the fluxes.

中文翻译：

---

焊膏配方助焊剂官能团对SAC305/CNT/Cu焊接质量的影响

本文的目的是根据焊膏的配方研究Sn-3.0Ag-0.5Cu（SAC305）/CNT/Cu焊点的润湿性和金属间化合物（IMC）层的形成，因为助焊剂类型不同。通过将 SAC305 焊料粉末与不同助焊剂和不同重量百分比的碳纳米管 (CNT) 混合来制备焊膏。傅里叶变换红外光谱用于识别来自不同焊膏助焊剂的官能团。然后对焊膏进行模板印刷和回流工艺。通过接触角分析和横截面金属间化合物层的厚度研究可焊性。发现来自不同助焊剂的不同官能团表现出不同的物理行为，由接触角值和 IMC 层厚度表示。“含芳香族”官能团降低接触角，而非含芳香族官能团降低IMC层厚度。CNT wt.% 越高，接触角和 IMC 层厚度越低，无论通量如何。由于通量不同，接触角与IMC层厚度之间的关系被发现具有不同的区域。因此，它可以作为焊膏配方助焊剂选择的指导。然而，本文并未进一步探讨助焊剂的详细成分。,SAC305/CNT/Cu 系统的焊点质量，如所示通过接触角和 IMC 层形成的厚度，取决于助焊剂官能团的存在。