This study aims to characterize a novel glass/epoxy architecture sandwich structure for electronic boards. Understanding the thermo-mechanical behavior of these composites is important because it is possible to pre-determine whether defined “internal” thick laminates will be suitable for embedding components in the direction of the axis “z,” i.e. this method of manufacturing multilayer laminates can be used for incoming miniaturization in electronics.,Laminates with a low glass transition temperature (Tg) and high Tg with E-glass type were treated, tested and compared. Testing samples were manufactured by nonstandard two steps unidirectional lamination as a multilayer structure based on prepreg layers and as “a sandwich structure” to explore its effect on thermo-mechanical properties. The proposed tested method determines the time and temperature-dependent viscoelastic properties of the board by using dynamic mechanical analysis, thermo-mechanical analysis and three-point bend tests.,This testing method was chosen because the main property that promotes sandwich structure is their high stiffness. Glass/epoxy stiff and thermal stabile sandwich structure prepared by nonstandard two-stage lamination is proper for embedding components and the next miniaturization in electronics.,Compared with by-default applied glass-reinforced homogenous laminates, novel architecture sandwich structure is attractive because of a combination of strength, stiffness and all while maintaining the miniaturization requirement and multifunctional application in electronics.

中文翻译：

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电子板用玻璃/环氧树脂夹层结构的性能

本研究旨在表征一种用于电子板的新型玻璃/环氧树脂结构夹层结构。了解这些复合材料的热机械性能很重要，因为可以预先确定定义的“内部”厚层压板是否适合在“z”轴方向上嵌入组件，即这种制造多层层压板的方法可以用于电子产品的小型化。对低玻璃化转变温度 (Tg) 和高 Tg 的 E 玻璃类型的层压板进行了处理、测试和比较。测试样品通过非标准的两步单向层压制造为基于预浸料层的多层结构和“夹层结构”，以探索其对热机械性能的影响。所提出的测试方法通过使用动态力学分析、热力学分析和三点弯曲测试来确定板的时间和温度相关的粘弹性性能。选择这种测试方法是因为促进夹层结构的主要特性是它们的高刚性。通过非标准两阶段层压制备的玻璃/环氧树脂刚性和热稳定夹层结构适用于嵌入组件和电子产品的下一次小型化。,与默认应用的玻璃增强均质层压板相比，新型建筑夹层结构具有吸引力，因为它具有以下优点：强度、刚度等的结合，同时保持电子产品的小型化要求和多功能应用。