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MEMS piezoresistive pressure sensor with patterned thinning of diaphragm
Microelectronics International ( IF 1.1 ) Pub Date : 2020-04-29 , DOI: 10.1108/mi-09-2019-0060
Zoheir Kordrostami , Kourosh Hassanli , Amir Akbarian

The purpose of this study is to find a new design that can increase the sensitivity of the sensor without sacrificing the linearity. A novel and very efficient method for increasing the sensitivity of MEMS pressure sensor has been proposed for the first time. Rather than perforation, we propose patterned thinning of the diaphragm so that specific regions on it are thinner. This method allows the diaphragm to deflect more in response with regard to the pressure. The best excavation depth has been calculated and a pressure sensor with an optimal pattern for thinned regions has been designed. Compared to the perforated diaphragm with the same pattern, larger output voltage is achieved for the proposed sensor. Unlike the perforations that have to be near the edges of the diaphragm, it is possible for the thin regions to be placed around the center of the diaphragm. This significantly increases the sensitivity of the sensor. In our designation, we have reached a 60 per cent thinning (of the diaphragm area) while perforations larger than 40 per cent degrade the operation of the sensor. The proposed method is applicable to other MEMS sensors and actuators and improves their ultimate performance.,Instead of perforating the diaphragm, we propose a patterned thinning scheme which improves the sensor performance.,By using thinned regions on the diaphragm rather than perforations, the sensitivity of the sensor was improved. The simulation results show that the proposed design provides larger membrane deflections and higher output voltages compared to the pressure sensors with a normal or perforated diaphragm.,The proposed MEMS piezoelectric pressure sensor for the first time takes advantage of thinned diaphragm with optimum pattern of thinned regions, larger outputs and larger sensitivity compared with the simple or perforated diaphragm pressure sensors.

中文翻译:

MEMS 压阻式压力传感器,膜片图案化减薄

本研究的目的是寻找一种新设计,可以在不牺牲线性度的情况下提高传感器的灵敏度。首次提出了一种提高MEMS压力传感器灵敏度的新颖且非常有效的方法。我们建议对隔膜进行图案化减薄,而不是穿孔,以便其上的特定区域更薄。这种方法允许隔膜根据压力而更多地偏转。已计算出最佳开挖深度,并设计了针对变薄区域具有最佳模式的压力传感器。与具有相同图案的穿孔隔膜相比,所提出的传感器实现了更大的输出电压。与必须靠近隔膜边缘的穿孔不同,薄区域可以放置在隔膜的中心周围。这显着提高了传感器的灵敏度。在我们的指定中,我们已经达到了(隔膜区域的)60% 的变薄,而大于 40% 的穿孔会降低传感器的运行。所提出的方法适用于其他 MEMS 传感器和执行器,并提高了它们的最终性能。,我们提出了一种图案化减薄方案,而不是穿孔隔膜,以提高传感器性能。,通过使用隔膜上的减薄区域而不是穿孔,灵敏度改进了传感器。仿真结果表明,与具有普通膜片或穿孔膜片的压力传感器相比,所提出的设计提供了更大的膜片偏转和更高的输出电压。
更新日期:2020-04-29
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