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TISM for analysis of barriers affecting the adoption of lean concepts to electronics component manufacture
International Journal of Lean Six Sigma ( IF 4 ) Pub Date : 2020-03-27 , DOI: 10.1108/ijlss-09-2018-0100
Senthil Kumar D. , S. Vinodh

The purpose of this paper is to present the analysis of barriers affecting the adoption of lean concepts to electrical and electronics component manufacturing.,Lean concepts are being increasingly applied by electrical and electronics component manufacturers to enhance product value through streamlined process. To facilitate smooth adoption of lean concepts, barriers need to be analyzed and prioritized. In this context, a structural model of 24 barriers is developed through total interpretive structural modeling (TISM) approach.,‘Changing governmental policies,’ ‘poor selection of change agents and improvement teams,’ ‘lack of top management commitment understanding and support of the system,’ ‘lack of team autonomy,’ ‘lack of flexibility and versatility’ and ‘lack of customer focus/involvement’ are found to be the dominant barriers based on TISM study. Interpretation statements are being derived from TISM model. Cross-impact matrix multiplication applied to classification analysis is conducted.,In the present paper, 24 barriers are considered. In future, additional barriers could be considered to deal with managerial advancements.,The paper reports the practical case of analysis of barriers to lean adoption in electronics component manufacture. Hence, the inferences have practical relevance.,The development of structural model for the analysis of barriers to lean implementation in electronics component manufacturing small- and medium-sized enterprises is the original contribution of the authors.

中文翻译:

TISM 用于分析影响采用精益概念进行电子元件制造的障碍

本文的目的是分析影响在电气和电子元件制造中采用精益概念的障碍。电气和电子元件制造商越来越多地应用精益概念,以通过简化流程提高产品价值。为了促进精益概念的顺利采用,需要分析障碍并确定优先级。在这种情况下,通过总体解释性结构模型 (TISM) 方法开发了一个包含 24 个障碍的结构模型。、“不断变化的政府政策”、“变革推动者和改进团队的选择不当”、“缺乏高层管理承诺理解和支持系统,“缺乏团队自主性,'''缺乏灵活性和多功能性'和'缺乏客户关注/参与'被发现是基于 TISM 研究的主要障碍。解释语句是从 TISM 模型派生出来的。进行了应用于分类分析的交叉影响矩阵乘法。,本文考虑了24个障碍。将来,可以考虑处理管理进步的其他障碍。本文报告了分析电子元件制造中采用精益的障碍的实际案例。因此,推论具有实际意义。,用于分析电子元件制造中小型企业精益实施障碍的结构模型的开发是作者的原创贡献。解释语句是从 TISM 模型派生出来的。进行了应用于分类分析的交叉影响矩阵乘法。,本文考虑了24个障碍。将来,可以考虑处理管理进步的其他障碍。本文报告了分析电子元件制造中采用精益的障碍的实际案例。因此,推论具有实际意义。,用于分析电子元件制造中小型企业精益实施障碍的结构模型的开发是作者的原创贡献。解释语句是从 TISM 模型派生出来的。进行了应用于分类分析的交叉影响矩阵乘法。,本文考虑了24个障碍。将来,可以考虑处理管理进步的其他障碍。本文报告了分析电子元件制造中采用精益的障碍的实际案例。因此,推论具有实际意义。,用于分析电子元件制造中小型企业精益实施障碍的结构模型的开发是作者的原创贡献。可以考虑额外的障碍来应对管理进步。这篇论文报告了分析电子元件制造中采用精益的障碍的实际案例。因此,推论具有实际意义。,用于分析电子元件制造中小型企业精益实施障碍的结构模型的开发是作者的原创贡献。可以考虑额外的障碍来应对管理进步。这篇论文报告了分析电子元件制造中采用精益的障碍的实际案例。因此,推论具有实际意义。,用于分析电子元件制造中小型企业精益实施障碍的结构模型的开发是作者的原创贡献。
更新日期:2020-03-27
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