Thermal contact resistance of solid–solid interface is involved in many fields such as aerospace, low-temperature superconductivity and electronic machinery. With the booming of aerospace technology, the requirements for space detectors continue to increase; the research on accurate prediction, measurement and utilization of thermal contact resistance is becoming increasingly serious. This article systematically summarizes and analyzes the research progress of thermal contact resistance. It also comparatively analyzes theoretical prediction models, steady-state and transient-state experimental methods and numerical analysis methods from different angles, and summarizes the advantages and disadvantages of different methods. Moreover, the effects of the influencing factors such as the physical properties, the surface state, the contact pressure, the contact temperature, the heat flux direction and the thermal interface materials on the solid–solid thermal contact resistance are also briefly described. Through this systematic comparative analysis, further development directions are pointed out.

中文翻译：

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接触热阻研究进展

固-固界面接触热阻涉及航空航天、低温超导、电子机械等诸多领域。随着航天技术的蓬勃发展，对空间探测器的要求不断提高；对接触热阻的准确预测、测量和利用的研究正日益受到重视。本文系统地总结和分析了接触热阻的研究进展。还从不同角度比较分析了理论预测模型、稳态和瞬态实验方法和数值分析方法，总结了不同方法的优缺点。此外，物理性能、表面状态、接触压力等影响因素的影响，还简要描述了接触温度、热流方向和固-固热接触电阻上的热界面材料。通过这种系统的比较分析，指出了进一步的发展方向。