The technology for evaluation of metal materials encompasses machine parts and structures. Residual stress is one indicator used for evaluating the strength and stiffness of metal materials. X-ray residual stress measurement is a non-destructive, non-contact, and precise method in various residual stress measurement methods. This method is used only for research purposes because of its long measurement time and large device size. Therefore, we developed a small, high-speed X-ray residual stress measurement device with a charge-integration-type silicon-on-insulator (SOI) pixel detector, INTPIX4, for industrial use.

Previous studies have shown that residual stress can be measured in less than 1 s by using a measurement device with an SOI pixel detector. In this study, we report a more detailed specification of the measurement device and consider its availability for metal material evaluation.

金属材料评估技术涵盖了机器零件和结构。残余应力是用于评估金属材料的强度和刚度的一种指标。X射线残余应力测量是各种残余应力测量方法中的一种非破坏性，非接触性且精确的方法。该方法测量时间长且设备尺寸大，仅用于研究目的。因此，我们开发了一种小型的高速X射线残余应力测量设备，该设备具有电荷集成型绝缘体上硅（SOI）像素检测器INTPIX4，可用于工业用途。

先前的研究表明，使用带SOI像素检测器的测量设备可以在不到1 s的时间内测量残余应力。在这项研究中，我们报告了一种更详细的测量设备规格，并考虑了其可用于金属材料评估的能力。