Abstract In order to attain high-quality Ti–Ni–Cu film, the surface morphologies, chemical compositions and mechanical properties of Ti–Ni–Cu thin films prepared by direct current (DC) magnetron sputtering at various processes were characterized by scanning electron microscopy (SEM), X-ray diffractometer (XRD) and tensile tests. The type of substrates, Ar pressure and sputtering power had significant effects on the quality and chemical composition of Ti–Ni–Cu thin film. Compared with Si and SiO 2 slides, it was easier to obtain freestanding films by adopting glass or piezoid slide as substrates. The Ti–Ni–Cu thin film deposited at lower pressure (0.10 Pa) had a better density. The surface was featured with porous structure in the Ti–Ni–Cu thin film prepared by higher Ar pressure of 0.36 Pa. In addition, both the tensile strength and strain of annealed Ti–Ni–Cu thin film continuously increased with Ar pressure decreasing. Higher density contributed to the superior mechanical properties. The deposition rate firstly increased and then decreased with Ar pressure and sputtering power increasing. The composition of deposited Ti–Ni–Cu film can be tailored by changing sputter power. The deposited Ti–Ni–Cu thin films at different processing parameters were in amorphous state. In short, the present study offered the important theoretical basis for the preparation of Ti–Ni–Cu thin film with higher quality and performance. Graphic abstract

中文翻译：

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具有较高铜含量的高质量 Ti-Ni-Cu 薄膜的沉积和表征

摘要 为了获得高质量的 Ti-Ni-Cu 薄膜，采用扫描电子显微镜对直流 (DC) 磁控溅射制备的 Ti-Ni-Cu 薄膜的表面形貌、化学成分和机械性能进行了表征。 (SEM)、X 射线衍射仪 (XRD) 和拉伸测试。衬底类型、Ar 压力和溅射功率对 Ti-Ni-Cu 薄膜的质量和化学成分有显着影响。与Si和SiO 2 载玻片相比，采用玻璃或压电载玻片作为基材更容易获得独立的薄膜。在较低压力 (0.10 Pa) 下沉积的 Ti-Ni-Cu 薄膜具有更好的密度。在 0.36 Pa 的更高 Ar 压力下制备的 Ti-Ni-Cu 薄膜表面具有多孔结构。此外，随着 Ar 压力的降低，退火后的 Ti-Ni-Cu 薄膜的拉伸强度和应变均不断增加。更高的密度有助于优异的机械性能。随着Ar压力和溅射功率的增加，沉积速率先增加后减小。沉积的 Ti-Ni-Cu 薄膜的成分可以通过改变溅射功率来定制。在不同工艺参数下沉积的 Ti-Ni-Cu 薄膜处于非晶态。总之，本研究为制备更高质量和性能的Ti-Ni-Cu薄膜提供了重要的理论依据。图形摘要 随着Ar压力和溅射功率的增加，沉积速率先增加后减小。沉积的 Ti-Ni-Cu 薄膜的成分可以通过改变溅射功率来定制。在不同工艺参数下沉积的 Ti-Ni-Cu 薄膜处于非晶态。总之，本研究为制备更高质量和性能的Ti-Ni-Cu薄膜提供了重要的理论依据。图形摘要 随着Ar压力和溅射功率的增加，沉积速率先增加后减小。沉积的 Ti-Ni-Cu 薄膜的成分可以通过改变溅射功率来定制。在不同工艺参数下沉积的 Ti-Ni-Cu 薄膜处于非晶态。总之，本研究为制备更高质量和性能的Ti-Ni-Cu薄膜提供了重要的理论依据。图形摘要