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Physicochemical Model of Selection of Complex Compounds for Electroless Metal Plating
Theoretical Foundations of Chemical Engineering ( IF 0.8 ) Pub Date : 2020-07-07 , DOI: 10.1134/s0040579520030136 E. G. Vinokurov , G. M. Mukhametova , T. F. Burukhina , V. D. Skopintsev , V. P. Meshalkin
中文翻译:
化学镀金属选择复合物的理化模型
更新日期:2020-07-07
Theoretical Foundations of Chemical Engineering ( IF 0.8 ) Pub Date : 2020-07-07 , DOI: 10.1134/s0040579520030136 E. G. Vinokurov , G. M. Mukhametova , T. F. Burukhina , V. D. Skopintsev , V. P. Meshalkin
Abstract
A physicochemical model of the choice of a ligand for the electroless deposition of metal–phosphorus alloys is proposed based on determining the conditions for electrochemical reactions that cause the formation of the alloy and minimizing possible side reactions that impede the quality of the deposition process. Based on the physicochemical model, the optimal range of values of the stability constants and pH was determined for electroless nickel plating. It is shown that, for the pH range 7–9, which corresponds to the maximum deposition rates, stability constants take values from 5 to 10; carrying out the process in more alkaline solutions requires the use of more stable complexes. The predictive ability of the model is confirmed by experimental studies of the process of electroless nickel plating from solutions of various ligand compositions.中文翻译:
化学镀金属选择复合物的理化模型