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Physicochemical Model of Selection of Complex Compounds for Electroless Metal Plating
Theoretical Foundations of Chemical Engineering ( IF 0.8 ) Pub Date : 2020-07-07 , DOI: 10.1134/s0040579520030136
E. G. Vinokurov , G. M. Mukhametova , T. F. Burukhina , V. D. Skopintsev , V. P. Meshalkin

Abstract

A physicochemical model of the choice of a ligand for the electroless deposition of metal–phosphorus alloys is proposed based on determining the conditions for electrochemical reactions that cause the formation of the alloy and minimizing possible side reactions that impede the quality of the deposition process. Based on the physicochemical model, the optimal range of values of the stability constants and pH was determined for electroless nickel plating. It is shown that, for the pH range 7–9, which corresponds to the maximum deposition rates, stability constants take values from 5 to 10; carrying out the process in more alkaline solutions requires the use of more stable complexes. The predictive ability of the model is confirmed by experimental studies of the process of electroless nickel plating from solutions of various ligand compositions.


中文翻译:

化学镀金属选择复合物的理化模型

摘要

基于确定导致合金形成的电化学反应的条件,并最大程度地减少了可能阻碍沉积质量的副反应,提出了一种化学化学模型,该化学模型用于选择金属磷合金的化学沉积方法。根据理化模型,确定化学镀镍的稳定常数和pH值的最佳范围。结果表明,在对应于最大沉积速率的7-9的pH范围内,稳定性常数取5到10的值。在更碱性的溶液中进行该方法需要使用更稳定的配合物。通过对各种配体组成的溶液进行化学镀镍的实验研究证实了模型的预测能力。
更新日期:2020-07-07
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