One of the issues in semiconductor device manufacturing is particle contamination on wafers. To improve the production yield of devices, it is necessary to reduce the number of particles. One approach to avoiding particle contamination caused by scattering in semiconductor processing apparatuses is by improving the adhesion forces between particles and surfaces of apparatus components. Such forces depend on the roughness of the surface where particles are attached. There are models to explain dependency of adhesion forces on the surface roughness. However, variations of the adhesion forces caused by surface roughness have not been sufficiently investigated in experiments. In this research, dependency between the adhesion forces of small particles and the surface roughness was evaluated by atomic force microscopy. It was found that reducing surface roughness to a nanometer scale increases the mean values and reduces the coefficients of variations of adhesion forces between partic...

中文翻译：

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通过原子力显微镜评估表面粗糙度对小颗粒粘附力的影响

半导体器件制造中的问题之一是晶圆上的颗粒污染。为了提高装置的产量，必须减少颗粒数量。避免由半导体加工设备中的散射引起的颗粒污染的一种方法是通过提高颗粒与设备部件表面之间的粘附力。这些力取决于附着有颗粒的表面的粗糙度。有一些模型可以解释粘附力对表面粗糙度的依赖性。然而，在实验中尚未充分研究由表面粗糙度引起的粘附力的变化。在这项研究中，通过原子力显微镜评估了小颗粒的粘附力与表面粗糙度之间的依赖性。