Abstract

Electron probe microanalysis (EPMA) has been used to obtain concentration curves and calculate the bulk diffusion coefficients of Sn in solid solutions of the copper–tin system in a tin concentration range of less than 13.9% weight (7.96 at %) and temperature range from 500 to 650°C. Diffusion couples are made from pure Cu (99.995%) and a two-component alloy of Cu with chemically pure Sn by direct alloying metallic Cu with Sn in an Ar–H₂ atmosphere at 1100°C for 2 h. Diffusion coefficients were calculated using the Matano–Boltzmann and Grube methods from the upper part of the concentration curve (from 6 to 8 at % (D₁)) and the lower part (from 2 at % to zero (D₂)). It is shown that Sn diffusion coefficients in a concentrated solution were several times greater than Sn diffusion coefficients in dilute solution. Both values of diffusion activation energy, especially the second, coincide with isotope data on Sn diffusion in a pure copper (187 kJ/mol). A qualitative interpretation is proposed of the effect of accelerating the diffusion of tin in a concentrated solid solution of the copper–tin system.

中文翻译：

---

锡在铜-锡系统固溶体中的扩散

摘要

电子探针微分析（EPMA）已用于获得浓度曲线，并计算在锡浓度范围小于13.9％重量（7.96 at％）和温度范围小于13.9％的锡溶液中，锡在铜-锡系统固溶体中的体积扩散系数。 500至650°C。扩散对是由纯铜（99.995％）和含化学纯锡的二元合金组成的，这是通过在1100°C的Ar–H ₂气氛中将金属铜与锡直接合金化2小时制成的。使用Matano–Boltzmann和Grube方法从浓度曲线的上半部（从6到8 at％（D ₁））和下半部（从2 at％到零（D ₂）计算扩散系数。））。结果表明，浓溶液中的锡扩散系数是稀溶液中的锡扩散系数的几倍。扩散活化能的两个值，尤其是第二个值，都与纯铜中Sn扩散的同位素数据（187 kJ / mol）一致。提出了定性解释，以加速锡在铜-锡系统的浓固溶体中的扩散。