Abstract

SHS-produced TiC–Al₂O₃ powders were used as a filler of organosilicon polymers and ethoxyline resin to prepare electroconducting polymeric compounds. The electrical conductivity of thus prepared polymeric compounds was found to depend on the amount of added ceramic powder, temperature, and type of polymer binder. A threshold effect observed for the temperature dependence of compound resistance can be used in designing temperature sensors and temperature/current-limiting devices. Our polymeric compounds can also be recommended as a material for film heaters with a working temperature of below 300°С.

中文翻译：

---

SHS生产的TiC–Al 2 O 3粉末填充的高分子化合物的电阻

摘要

SHS生产的TiC–Al ₂ O ₃粉末被用作有机硅聚合物和乙氧基树脂的填料，以制备导电聚合物。发现由此制备的聚合物的电导率取决于添加的陶瓷粉末的量，温度和聚合物粘合剂的类型。对于复合电阻的温度依赖性观察到的阈值效应可用于设计温度传感器和温度/电流限制设备。我们的聚合化合物也可以推荐用作工作温度低于300°С的薄膜加热器的材料。