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Advanced Ultrasonic NDT for Weak Bond Detection in Composite-Adhesive Bonded Structures
International Journal of Adhesion and Adhesives ( IF 3.4 ) Pub Date : 2020-10-01 , DOI: 10.1016/j.ijadhadh.2020.102675
Bengisu Yılmaz , Elena Jasiūnienė

Abstract Weak bond detection in composite-adhesive joints is a highly challenging task in the NDT community. This paper aims to evaluate the bonding quality in composite-adhesive bonded structures with high-frequency high-resolution acoustic microscopy. Carbon fibre reinforced epoxy-epoxy bonded single lap joints containing three different bonding quality -debonding, weak bond with less and more contamination-in addition to perfect bond-were investigated. Shape-based feature extraction algorithm in the frequency domain was developed in order to detect weak bonds. The results show that high frequency focused transducers used in acoustic microscopy is a great choice to visualize interface quality in bonded structures. Developed post-processing algorithm performs well on the detection of weak bond, independent from the perfect bond inspection results.

中文翻译:

用于复合粘合剂粘合结构中弱键检测的高级超声波无损检测

摘要复合粘合剂接头中的弱键检测是无损检测界的一项极具挑战性的任务。本文旨在用高频高分辨率声学显微镜评估复合粘合剂粘合结构的粘合质量。碳纤维增强环氧-环氧树脂粘合单搭接接头包含三种不同的粘合质量——脱粘、污染越来越少的弱粘合——以及完美粘合。开发了频域中基于形状的特征提取算法以检测弱键。结果表明,声学显微镜中使用的高频聚焦换能器是可视化粘合结构中界面质量的绝佳选择。开发的后处理算法在弱键检测上表现良好,独立于完美的键检测结果。
更新日期:2020-10-01
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