With the development of highly integrated electronic devices, there are growing demands for high performance thermal management materials with high thermal conductivity and electrical insulation. Herein, we report thermal properties of epoxy-based SiC aerofoam composites. A novel three-dimensional structure of covalently interconnected porous SiC (3D-SiC) aerofoam is successfully fabricated using 3D reduced graphene oxide foam as a template, and it was embedded in epoxy resin and cured to prepare thermoconductive composites. The formation of covalent SiC linkage and presence of interconnected 3D-SiC aerofoam resulted in thermal conductivity of the epoxy composites as high as 10.26 W·m⁻¹·K⁻¹ at 6.52 vol% of SiC, which calculated as thermal conductivity enhancement efficiency per 1 vol% of filler loading equals to 859%. The 3D-SiC/epoxy composites showed an excellent heat dissipation performance compared to that of a commercial thermal pad. The 3D-SiC/epoxy composite is a highly prospective candidate as next generation thermal dissipating material for electronic devices.

随着高度集成的电子设备的发展，对具有高导热率和电绝缘性的高性能热管理材料的需求不断增长。在此，我们报告了环氧基SiC航空泡沫复合材料的热性能。以3D还原氧化石墨烯泡沫为模板，成功地制备了共价互连的多孔SiC（3D-SiC）航空泡沫的新型三维结构，并将其嵌入环氧树脂中并固化，制备出导热复合材料。共价SiC键的形成以及相互连接的3D-SiC航空泡沫的存在导致环氧复合材料的导热系数高达10.26 W·m ^-1 ·K ^-1SiC含量为6.52体积％时，按每1体积％填充剂的导热系数提高效率计算，等于859％。与商用导热垫相比，3D-SiC /环氧树脂复合材料具有出色的散热性能。3D-SiC /环氧树脂复合材料是电子设备的下一代散热材料，具有很高的前景。