Abstract The bonding technique has received extensive attention in the recent decades. Unlike the use of metallic screws, screws or rivets, some of the advantages of this bonding technique include the elimination of stress concentration, lighter weight and the extension of the life cycle of the adhesively bonded structures. The stiffness and strength of a material are increased after bonding with another reinforced material, but it can only be effective if the interface is able to transfer bond stresses. However, how the bond stress transfer is carried out when the joint, reinforcement and substrate are subjected to a thermal loading is not yet well understood. One way to facilitate and improve such knowledge is to develop analytical solutions that, despite their simplicity, allow parameters to be identified that may directly influence the bond between materials. Therefore, the present study aims to develop a series of closed-form solutions able to describe the debonding process of bonded joints with different characteristics using two different exponential softening laws. The results mainly describe the interfacial slips, bond stresses and strains in both materials during the temperature increase process. In total, 108 examples with different bonding conditions are studied and, at the same time, numerically modelled through the Finite Element Method (FEM). The numerical results were compared to the proposed closed-form solutions and a satisfactory agreement was obtained between the numerical and analytical results, validating the latter. When considered in the simulations, the glass transition temperature (Tg) of the adhesive greatly affected the bond stress transfer between materials and compromising the initial integrity of the adhesively bonded structure.

中文翻译：

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通过指数软化定律模拟热载荷下粘合接头响应的封闭形式解决方案

摘要 近几十年来，键合技术受到了广泛的关注。与使用金属螺钉、螺钉或铆钉不同，这种粘接技术的一些优点包括消除应力集中、重量更轻和延长粘接结构的生命周期。与另一种增强材料粘合后，材料的刚度和强度会增加，但只有在界面能够传递粘合应力时才能有效。然而，当接头、加强件和基材受到热负荷时，粘合应力是如何传递的还不是很清楚。促进和改进这些知识的一种方法是开发分析解决方案，尽管它们很简单，允许识别可能直接影响材料之间结合的参数。因此，本研究旨在开发一系列封闭形式的解决方案，能够使用两种不同的指数软化定律来描述具有不同特性的粘合接头的脱粘过程。结果主要描述了两种材料在升温过程中的界面滑移、键应力和应变。总共研究了 108 个具有不同键合条件的示例，同时通过有限元方法 (FEM) 对其进行了数值建模。将数值结果与所提出的封闭形式的解进行比较，数值和解析结果之间获得了令人满意的一致性，验证了后者。当在模拟中考虑时，