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Promotional Effect of Cu for Catalytic Amination of Diethylene Glycol with Tertiarybutylamine over Ni–Cu/Al2O3 Catalysts
Catalysis Letters ( IF 2.8 ) Pub Date : 2020-02-19 , DOI: 10.1007/s10562-020-03145-8
Yifan Wu , Wenying Gui , Xiaofei Liu , Li Zhang , Shuoxue Wang , Zhenlu Wang , Chunlei Zhang

In this work, we synthesized a series of 20% Ni-x% Cu/Al2O3 catalysts containing various Cu loading by the impregnation method and investigated their catalytic performance in the amination of diethylene glycol (DEG) with tertiarybutylamine (TBA) to tertiarybutylaminoethoxyethanol (TBEE). A variety of characterization techniques including XRD, TEM, BET, XPS, H2-TPR, NH3-TPD, CO2-TPD were applied. The promotional influence of Cu on the catalytic performance of Ni/Al2O3 catalyst was studied, and the optimal addition of Cu was obtained. Indeed, we found that Ni–Cu alloy was formed after reduction of the Ni–Cu/Al2O3 catalysts. Due to the strong interaction between Cu and Ni, Cu could improve the reducibility of NiO and the dispersion of Ni species on the catalyst surface, which were critical factors for higher reactivity of the bimetallic Ni–Cu/Al2O3 catalysts. Moreover, the influence of catalyst reduction temperature and reaction temperature were examined. When operating at 230 °C, the 20% Ni-10% Cu/Al2O3 catalyst reduced at 500 °C for 2 h exhibited superior catalytic performance in this reaction. Ni-Cu/Al2O3 catalyst was found to be an effective catalyst for catalytic amination of diethylene glycol with tertiarybutylamine.

中文翻译:

Cu在Ni-Cu/Al2O3催化剂上对叔丁胺催化二乙二醇胺化的促进作用

在这项工作中,我们通过浸渍法合成了一系列含有不同 Cu 负载量的 20% Ni-x% Cu/Al2O3 催化剂,并研究了它们在二甘醇 (DEG) 与叔丁胺 (TBA) 胺化成叔丁氨基乙氧基乙醇 (TBEE) 中的催化性能。 )。应用了多种表征技术,包括 XRD、TEM、BET、XPS、H2-TPR、NH3-TPD、CO2-TPD。研究了Cu对Ni/Al2O3催化剂催化性能的促进作用,得到了Cu的最佳添加量。事实上,我们发现 Ni-Cu/Al2O3 催化剂还原后形成 Ni-Cu 合金。由于 Cu 和 Ni 之间的强相互作用,Cu 可以提高 NiO 的还原性和 Ni 物种在催化剂表面的分散,这是提高双金属 Ni-Cu/Al2O3 催化剂反应活性的关键因素。此外,还考察了催化剂还原温度和反应温度的影响。在 230 °C 下操作时,20% Ni-10% Cu/Al2O3 催化剂在 500 °C 下还原 2 小时,在该反应中表现出优异的催化性能。发现 Ni-Cu/Al2O3 催化剂是二甘醇与叔丁胺催化胺化的有效催化剂。
更新日期:2020-02-19
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