Abstract In this study, a thermal buckling analysis of laminate composite square plate was performed with elliptical hole cutout using the finite element method. Graphite/Epoxy laminate plate used in this study is symmetrical stacking sequence plate [(0/90)2]s. This laminate square plate was subjected to temperature loading with clamped support on all edges. Moreover, the parameters considered were fiber orientation (θ), a/b ratio (elliptical hole), elliptical hole inclination (φ), thermal expansion coefficient ratio (α1/α2), and thickness of plates (t). The results showed that as the thermal expansion coefficient ratio changes, the elliptical hole ratio and the elliptical hole inclination have inconsequential effects on the performance of the resistance of laminate composite plates. The maximum values of thermal buckling amplification factor were obtained when the ratio a/b = 1.0, which is a circle cutout,while the minimum values were obtained when the ratio a/b = 0.5, regardless of the thickness of plates. Moreover, the plate with elliptical or circle cutout hole provides about 4% to 9% higher buckling resistance than that of the plate without hole cutout, because when subjected to temperature loading the plate with hole can release stress better than the plate without hole.

中文翻译：

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热屈曲载荷作用下层压复合板椭圆孔效应的参数研究

摘要 在这项研究中，使用有限元方法对具有椭圆孔切口的层压复合方板进行了热屈曲分析。本研究中使用的石墨/环氧树脂层压板是对称堆叠序列板[(0/90)2]s。该层压方板在所有边缘上都带有夹紧支撑件，从而承受温度载荷。此外，考虑的参数是纤维取向（θ）、a/b 比（椭圆孔）、椭圆孔倾角（φ）、热膨胀系数比（α1/α2）和板厚（t）。结果表明，随着热膨胀系数比的变化，椭圆孔比和椭圆孔倾角对层压复合板的电阻性能影响不大。热屈曲放大系数的最大值在a/b = 1.0时获得，这是一个圆形切口，而最小值在a/b = 0.5时获得，与板的厚度无关。此外，椭圆形或圆形开孔板比无开孔板的抗屈曲强度高约4%至9%，因为在承受温度载荷时，开孔板比无孔板更能释放应力。