当前位置: X-MOL 学术Mater. Lett. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Microstructure and thermal conductivity of Si-Al-C-O fiber bonded ceramics joined to refractory metals
Materials Letters ( IF 3 ) Pub Date : 2020-10-01 , DOI: 10.1016/j.matlet.2020.128203
M.C. Vera , J. Martinez-Fernandez , M. Singh , V. Casalegno , C. Balagna , J. Ramirez-Rico

Abstract We explore joining Si-Al-C-O fiber-bonded ceramics to Cu-clad-Mo using an Ag-Ti-Cu brazing alloy. A temperature of 900 °C and times in the range of 10–20 min are required to obtain sound joints irrespectively of the fiber orientation. The reaction layer is 1–2 μm thick and free of pores and defects. The thermal conductivity of the joined samples is well described considering that the metal and the ceramic are in series for thermal resistance. This implies that the joint is highly conductive and forms an almost perfect thermal interface between the two materials, confirming the quality of the obtained brazing layer.

中文翻译:

Si-Al-CO 纤维结合陶瓷与难熔金属结合的显微组织和热导率

摘要 我们探索了使用 Ag-Ti-Cu 钎焊合金将 Si-Al-CO 纤维结合陶瓷连接到 Cu-clad-Mo 上。无论纤维取向如何,都需要 900 °C 的温度和 10-20 分钟的时间来获得良好的接头。反应层厚度为 1-2 μm,没有孔隙和缺陷。考虑到金属和陶瓷串联以提供热阻,连接样品的热导率得到了很好的描述。这意味着接头具有高导电性,并在两种材料之间形成几乎完美的热界面,证实了所获得的钎焊层的质量。
更新日期:2020-10-01
down
wechat
bug