Abstract Sn-3Ag-0.5Cu solder exhibits an internal friction peak, which corresponds to the sliding of the grain boundaries, in the heating internal friction curve. The activation energy of the internal friction peak increases with the number of reinforced multiwall carbon nanotubes (MWCNTs) because the Sn-3Ag-0.5Cu solder has a finer grain size and more abundant sliding grain boundaries after reinforcement with MWCNTs. The activation energy of the high-temperature damping background (HTDB) of the Sn-3Ag-0.5Cu solder decreases after reinforcement with MWCNTs, indicating that MWCNT reinforcement accelerates the dislocation diffusion process and creep process at the HTDB temperature of the Sn-3Ag-0.5Cu solder.

中文翻译：

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增强型多壁碳纳米管对Sn-Ag-Cu无铅焊料阻尼特性的影响

摘要 Sn-3Ag-0.5Cu 焊料在加热内摩擦曲线中呈现出一个内摩擦峰，它对应于晶界的滑动。由于 Sn-3Ag-0.5Cu 焊料在用多壁碳纳米管 (MWCNT) 增强后具有更细的晶粒尺寸和更丰富的滑动晶界，因此内摩擦峰的活化能随着增强的多壁碳纳米管 (MWCNT) 的数量而增加。Sn-3Ag-0.5Cu焊料高温阻尼背景（HTDB）的活化能在用MWCNTs增强后降低，表明MWCNT增强加速了Sn-3Ag-HTDB温度下的位错扩散过程和蠕变过程。 0.5Cu焊料。