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Atomic Layer Deposition for Polypropylene Film Engineering—A Review
Macromolecular Materials and Engineering ( IF 3.9 ) Pub Date : 2020-06-15 , DOI: 10.1002/mame.202070014
Guanghui Song , Daniel Q. Tan

Front Cover : In article number 2000127, Guanghui Song and Daniel Q. Tan summarize the recent advances in atomic layer deposition (ALD) techniques to engineer polypropylene (PP) film surfaces. ALD is a self‐limiting reaction process between gas and solid phases that allows precise control of atomby‐atom growth of the coating layer on a dense PP surface or within the pores of a membrane. Ultrathin layers of inorganic coating promise effective enhancement in the functionality, absorption, activation, mechanical and dielectric properties of PP films for the benefit of energy storage, film capacitors, catalytic membranes, and filtration/separation applications.
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中文翻译:

聚丙烯薄膜工程的原子层沉积研究进展

前封面:宋光辉和Daniel Q. Tan在文章2000127中总结了原子层沉积(ALD)技术在工程聚丙烯(PP)薄膜表面方面的最新进展。ALD是气相和固相之间的自限反应过程,可以精确控制致密PP表面或膜孔内涂层的逐原子生长。无机涂层的超薄层有望有效增强PP薄膜的功能,吸收,活化,机械和介电性能,从而有利于储能,薄膜电容器,催化膜和过滤/分离应用。
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更新日期:2020-06-15
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