Layerwise theory (LT) along with third-order, hyperbolic, and combination of sinusoidal and exponential shear deformation theories (TSDT, HSDT, and SESD) is applied to calculate thermal stresses in a five-layer simply supported circular sandwich plate subjected to a temperature gradient. The sandwich plate is made of five layers consisting of two functional graded (FG) face sheets, two adhesive layers, and one core. The results are compared to finite element (FE) and indicate that the results of LT along with SESD are closer to those obtained by FE in comparison with TSDT and HSDT. Moreover, the effects of the geometrical and mechanical characteristics of face sheets as well as mechanical properties of adhesive are studied to determine the stress distribution in adhesive layers. The results show that the variation of the FG of face sheets has more effect on the adhesive shear and piling stresses than the planner stresses.

应用分层理论（LT）以及三阶，双曲线以及正弦和指数剪切变形理论（TSDT，HSDT和SESD）的组合来计算承受温度的五层简支圆形夹层板的热应力梯度。夹心板由五层组成，包括两层功能梯度（FG）面板，两层粘合剂层和一个芯层。将结果与有限元（FE）进行比较，表明与TSDT和HSDT相比，LT和SESD的结果更接近于FE获得的结果。此外，研究了面板的几何和机械特性以及粘合剂的机械性能的影响，以确定粘合剂层中的应力分布。