Multilayer film is widely used in mechanical, optical, electronic, computer, sensor, recording, aerospace and weapon applications. In the thin‐film energy conversion device, it is desirable to use film to convert more energy. This work investigated the electric explosion performance of Ni/Cu multilayer films that were prepared by using the electrodeposition method. The cross‐section SEM image verified the layered structure of Ni/Cu multilayer foil. The metal in the Ni/Cu multilayer film grew in polycrystalline. The temperature of exothermic reaction in the Ni/Cu multilayer started at 1056 °C. We measured the current and voltage curves of foils with different bridge area. The combination of Cu and Ni in multilayer could improve the initial resistance of foil. The deposited energy of Ni/Cu multilayer foil with a bridge area of 0.4×0.4 mm was 105.57 mJ while the bridge area of 0.3×0.3 mm was 93.05 mJ at charging voltage of 3000 V. Compared with Cu foil, Ni/Cu multilayer foil with bridge area of 0.4×0.4 mm burst earlier and deposited 10.5 mJ more energy. As a result, when the modulation cycle of Ni/Cu multilayer film is 200/300 nm, the Ni/Cu multilayer foil with a bridge area of 0.4×0.4 mm has potential application in exploding foil.

中文翻译：

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Ni / Cu多层箔的电爆炸性能分析

多层膜广泛用于机械，光学，电子，计算机，传感器，记录，航空航天和武器应用。在薄膜能量转换装置中，希望使用薄膜来转换更多的能量。这项工作研究了通过电沉积方法制备的Ni / Cu多层膜的电爆炸性能。横截面SEM图像证实了Ni / Cu多层箔的层状结构。Ni / Cu多层膜中的金属以多晶形式生长。Ni / Cu多层膜中的放热反应温度始于1056°C。我们测量了具有不同桥面积的箔的电流和电压曲线。多层中Cu和Ni的组合可以提高箔的初始电阻。桥面积为0.4×0.4mm的Ni / Cu多层箔的沉积能量为105。充电电压为3000 V时，电桥面积为57 mJ，而0.3×0.3 mm的电桥面积为93.05 mJ。与Cu箔相比，电桥面积为0.4×0.4 mm的Ni / Cu多层箔较早破裂，并沉积了10.5 mJ的更多能量。结果，当Ni / Cu多层膜的调制周期为200 / 300nm时，桥接面积为0.4×0.4mm的Ni / Cu多层箔在爆炸箔中具有潜在的应用。