Polymeric composites with the advantages of easy process, light weight and good chemical resistance were employed in thermal management. The construction of a new type thermal conductive filler has become an efficient method for improving the thermal transportation performance of polymer composite. In this work, a barnacle-like nano-crystalline diamond@silicon carbide (ND@SiC) is prepared through depositing ND on SiC powders in a hot filament chemical vapor deposition (HFCVD). ND@SiC/PVDF composite was prepared and their thermal transportation properties were investigated. The obtained composites with 70 wt% ND@SiC loading exhibit a high thermal conductivity of 2.39 W m⁻¹ K⁻¹, which increased by 1132% in comparison with the pure polymer. It is also much higher than that of the composite adding 70 wt% SiC powders (1.48 W m⁻¹ K⁻¹). The high thermal conductivity of polymer composites by adding the ND@SiC filler is mainly attributed to the novel barnacle-like structure. This work provides a new idea to significantly enhance thermal transportation properties of composites as used in advanced packaging materials.

具有易于加工，重量轻和耐化学性好的优点的聚合物复合材料被用于热管理。新型导热填料的构建已成为改善聚合物复合材料导热性能的有效方法。在这项工作中，通过在热丝化学气相沉积（HFCVD）中将ND沉积在SiC粉末上，制备出了类似藤壶状的纳米晶碳化硅（ND @ SiC）。制备了ND @ SiC / PVDF复合材料，研究了其热传输性能。所获得的具有70wt％的ND @ SiC负载的复合材料表现出2.39 W m ^-1 K ^-1的高导热率与纯聚合物相比增加了1132％。它也比添加了70 wt％SiC粉的复合材料（1.48 W m ^-1 K ^-1）高得多。通过添加ND @ SiC填料，聚合物复合材料的高导热率主要归因于新颖的藤壶状结构。这项工作提供了一种新的想法，可以显着提高高级包装材料中使用的复合材料的热传输性能。