Continuous polishing (CP) using a pitch lap plays a vital role in finishing large flat optical workpiece. The effects of key mechanical parameters in CP can be characterized by the contact pressure and friction force at the workpiece/lap interface. In this study, a novel on-line interfacial contact pressure and friction force wireless measurement system is developed for the practical CP process. These mechanical factors varying with polishing time are measured in experiments and its effect on material removal is theoretically analyzed. A liquid bridge model is proposed to explain the negative contact pressure at slurry channel edge and the enhanced contact pressure at the abrasive slurry lubrication condition. Experimental results reveal the material removal coefficient is linear to time average COF under given polishing conditions and there exists significant non-uniformity in material removal coefficient along the workpiece radial direction.

使用节距抛光垫进行连续抛光（CP）在精加工大型平面光学工件中起着至关重要的作用。CP中关键机械参数的影响可以通过工件/搭接界面处的接触压力和摩擦力来表征。在这项研究中，针对实际的CP过程开发了一种新颖的在线界面接触压力和摩擦力无线测量系统。在实验中测量了随抛光时间而变化的这些机械因素，并从理论上分析了其对材料去除的影响。提出了一种液桥模型来解释浆料通道边缘的负接触压力和磨料浆料润滑条件下的增加的接触压力。