Adhesives are widely used in electronic packaging and are of vital importance in the reliability of electronic systems. A deep understanding of the degradation mechanism of adhesives under corrosion load plays a key role in lifetime prediction. Unfortunately, most of the common reliability tests are destructive. The present approach combines the nondestructive methods, electrochemical impedance spectroscopy and the Fourier‐transform infrared spectroscopy, as powerful tools in a complementary manner to describe the degradation mechanism and kinetics of two epoxy‐based adhesives, which are commonly used in electronic packaging. It is demonstrated that the application quality is the dominating impact on the optimization of the lifetime.

中文翻译：

---

电子包装中粘合剂降解的补充EIS / FTIR研究

胶粘剂广泛用于电子包装，对电子系统的可靠性至关重要。对胶粘剂在腐蚀载荷下的降解机理的深刻理解在寿命预测中起着关键作用。不幸的是，大多数常见的可靠性测试都是破坏性的。本方法将非破坏性方法，电化学阻抗谱和傅里叶变换红外光谱相结合，作为一种强大的工具，以互补的方式描述了电子包装中常用的两种环氧基胶的降解机理和动力学。结果表明，应用质量是生命周期优化的主要影响因素。