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Sandwiched Graphene Clad Laminate: A Binder‐Free Flexible Printed Circuit Board for 5G Antenna Application
Advanced Engineering Materials ( IF 3.6 ) Pub Date : 2020-06-11 , DOI: 10.1002/adem.202000451
Rongguo Song 1 , Xin Zhao 2 , Zhe Wang 2 , Huaqiang Fu 2 , Kunkun Han 3 , Wei Qian 2 , Suyan Wang 3 , Jie Shen 3 , Boyang Mao 4 , Daping He 2
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Printed circuit board (PCB), as the basic mechanically supports of electronic devices, is widely used in circuit, radio frequency (RF), and other fields. Copper is the most commonly used conductive material in the PCB structure due to its high electrical conductivity and matured manufacture techniques. Despite the advantages, with the increasing demand of electronic products, metal waste is becoming a severe problem, as it can cause significant environment pollutions. Metal materials also suffer from high prices (because of their limited reserves), relatively poor flexibility, large density, and easily oxidized. As communication technologies developing, copper and other traditional metals-based PCB are becoming difficult to meet the new requirements for 5G communication devices, such as of being lightweight, flexible, miniaturized, and chemically stable under certain severe conditions. Therefore, it is necessary to find a suitable material to realize metal substitution in the field of electronic products based on PCB. Many attempts have been made to find the right candidates for such substitution of copper so far. Recently, carbon-based allotropic materials, such as carbon nanotubes (CNTs), carbon fibers, graphene, and fullerenes, have been widely investigated in the fields of antennas, sensors, transistors, and other electronic fields, given that they are abundant in nature and their advanced properties of lightweight, corrosion resistant, and environmental friendly. For instance, CNTs not only have excellent mechanical properties, biocompatibility, and chemical stability, but also have the disadvantages of low conductivity, complex film-forming process, and high contact resistance. Fullerenes, such as the CNTs, also suffer from low conductivity and difficult film forming, which lead to the problems of high loss and unsatisfactory performance

中文翻译:

夹层石墨烯复合板:用于 5G 天线应用的无粘合剂柔性印刷电路板

印刷电路板(PCB)作为电子设备的基本机械支撑,广泛应用于电路、射频(RF)等领域。铜由于其高导电性和成熟的制造技术,是PCB结构中最常用的导电材料。尽管有这些优点,但随着电子产品需求的增加,金属废物正成为一个严重的问题,因为它会造成严重的环境污染。金属材料也存在价格高(储量有限)、柔韧性较差、密度大、易氧化等问题。随着通信技术的发展,铜等传统金属基PCB越来越难以满足5G通信设备的轻量化、柔性化、小型化、小型化等新要求。并且在某些恶劣条件下具有化学稳定性。因此,有必要在基于PCB的电子产品领域寻找合适的材料来实现金属替代。迄今为止,已经进行了许多尝试来寻找合适的替代铜的候选物。近年来,碳基同素异形材料,如碳纳米管(CNTs)、碳纤维、石墨烯和富勒烯,由于它们在自然界中的丰富性,在天线、传感器、晶体管和其他电子领域得到了广泛的研究。以及轻质、耐腐蚀、环保等先进性能。例如,碳纳米管不仅具有优异的机械性能、生物相容性和化学稳定性,而且还具有导电率低、成膜过程复杂、和高接触电阻。碳纳米管等富勒烯也存在导电率低、成膜困难等问题,存在损耗大、性能不理想的问题
更新日期:2020-06-11
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