Superconformal copper electrodeposition of nano-micro printed circuit board (PCB) is of prime importance in microelectronics manufacturing. It is very challenging and still remains deficient exploration to fully realize efficient conformal electrodeposition in the emerging organic additives. Herein, a family of quinacridone (QA) derivatives bearing quaternary ammonium groups were synthesized via two steps with high yields. These compounds were functionalized as promising levelers for superconformal Cu deposition for the first time. Alkyl chains and aryl groups tuning strategies were performed to precisely synthesize and optimize these QA levelers. The optimal leveling agent (DCQA-C₈-QAS) and electrodeposition formula were obtained through electrochemical measurements, theoretical calculations and through-hole (TH) electrodeposition experiments. The superior leveling behavior of DCQA-C₈-QAS was mainly attributed to the strong interaction and adhesion ability towards copper surface, which were verified by X-ray photoelectron spectra (XPS), atomic force microscope (AFM) and contact angle detection (CA).

纳米微印刷电路板（PCB）的超保形铜电沉积在微电子制造中至关重要。在新兴的有机添加剂中完全实现高效的保形电沉积是非常具有挑战性的，并且仍然缺乏探索。本文中，通过两个步骤以高产率合成了带有季铵基团的喹ac啶酮（QA）衍生物家族。这些化合物首次被功能化为有望用于超共形铜沉积的整平剂。进行了烷基链和芳基基团调节策略，以精确合成和优化这些QA整平剂。最佳流平剂（DCQA-C ₈-QAS）和电沉积公式通过电化学测量，理论计算和通孔（TH）电沉积实验获得。DCQA-C ₈ -QAS的优异流平性能主要归因于对铜表面的强相互作用和粘附能力，这已通过X射线光电子能谱（XPS），原子力显微镜（AFM）和接触角检测（CA）进行了验证。 ）。