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Physical and electrical properties’ evaluation of SnS:Cu thin films
Surface Engineering ( IF 2.8 ) Pub Date : 2020-04-24 , DOI: 10.1080/02670844.2020.1754623 S. Sebastian 1 , I. Kulandaisamy 1 , S. Valanarasu 1 , Mohd Shkir 2 , V. Ganesh 2 , I. S. Yahia 2, 3 , Hyun-Seok Kim 4 , Dhanasekaran Vikraman 4
Surface Engineering ( IF 2.8 ) Pub Date : 2020-04-24 , DOI: 10.1080/02670844.2020.1754623 S. Sebastian 1 , I. Kulandaisamy 1 , S. Valanarasu 1 , Mohd Shkir 2 , V. Ganesh 2 , I. S. Yahia 2, 3 , Hyun-Seok Kim 4 , Dhanasekaran Vikraman 4
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This paper reports successful fabrication of copper-doped tin sulphide (SnS:Cu) thin films using nebulized spray pyrolysis. Different Cu doping concentrations (2, 4, 6, and 8 wt-%) were employed to...
中文翻译:
SnS:Cu薄膜的物理和电学性能评估
本文报道了使用雾化喷雾热解成功制造掺铜硫化锡 (SnS:Cu) 薄膜。采用不同的 Cu 掺杂浓度(2、4、6 和 8 重量%)来...
更新日期:2020-04-24
中文翻译:
SnS:Cu薄膜的物理和电学性能评估
本文报道了使用雾化喷雾热解成功制造掺铜硫化锡 (SnS:Cu) 薄膜。采用不同的 Cu 掺杂浓度(2、4、6 和 8 重量%)来...