ABSTRACT A cyclic DSC method has been adapted to study the TLPB behaviour and isothermal solidification rate (IS) in an IN625/CPW475 base metal/filler metal joint at 1000°C. Analysis of the DSC data resulted in a prediction of the maximum brazing clearance (MBC) as a function of braze time. The rate of IS was determined to be linear with the square root of time with a rate constant k = 4.59 µm/min1/2, once the braze temperature and isothermal conditions were reached. During transient heating from the solidus temperature up to the braze temperature there is a region of rapid boron uptake by the base metal and an accelerated growth rate of the IS zone (ISZ). This initial ISZ layer, 2wISZi was predicted to be 29.5 µm. In the current case of an initial gap width of 80 µm, this initial ISZ represents 36% of the gap width.

中文翻译：

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研究含钯的 Ni-B 基钎料的瞬态液相键合 (TLPB) 行为

摘要 采用循环 DSC 方法研究了 IN625/CPW475 母材/填充金属接头在 1000°C 下的 TLPB 行为和等温凝固速率 (IS)。对 DSC 数据的分析得出了作为钎焊时间函数的最大钎焊间隙 (MBC) 的预测。一旦达到钎焊温度和等温条件，IS 的速率被确定为与时间的平方根呈线性关系，速率常数 k = 4.59 µm/min1/2。在从固相线温度到钎焊温度的瞬态加热过程中，有一个区域的硼被母材快速吸收，并且 IS 区 (ISZ) 的生长速度加快。该初始 ISZ 层 2wISZi 预计为 29.5 µm。在当前初始间隙宽度为 80 µm 的情况下，该初始 ISZ 代表间隙宽度的 36%。