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Effect of copper chloride layer on the oxidation-sulfation resistance of copper at 200°C
Canadian Metallurgical Quarterly ( IF 0.9 ) Pub Date : 2020-03-18 , DOI: 10.1080/00084433.2020.1741898
M. Lindgren 1 , T. Suortti 1
Affiliation  

ABSTRACT The effect of chloride exposure on copper cooling element corrosion was investigated in a simulated flash smelting furnace atmosphere. Field samples exposed to low and high chloride loads were first characterized with a scanning electron microscope. The main difference between the samples was the presence of a separate copper chloride layer in the samples that had been exposed to high chloride loads. The samples were then used in thermogravimetric experiments in 50% SO2-20% O2-20% N2-10% CO2 at 200°C for five days to gain an understanding of how the presence of chlorides influences the intermediate temperature reactions in an oxidizing-sulfating environment. The resulting complex corrosion product layers were once more subjected to microscopical examination. The previous exposure to chlorides that had led to the formation of a copper chloride layer accelerated the corrosion rate and changed the attack mechanism.

中文翻译:

氯化铜层对铜200℃抗氧化硫酸化性能的影响

摘要 在模拟闪速熔炼炉气氛中研究了氯化物暴露对铜冷却元件腐蚀的影响。暴露于低氯和高氯负荷的现场样品首先用扫描电子显微镜进行表征。样品之间的主要区别在于暴露于高氯化物负载的样品中存在单独的氯化铜层。然后将样品用于 200°C 下 50% SO2-20% O2-20% N2-10% CO2 中的热重实验五天,以了解氯化物的存在如何影响氧化过程中的中间温度反应。硫酸化环境。对所得复杂腐蚀产物层再次进行显微镜检查。
更新日期:2020-03-18
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