In this work, 0.5 mol L−1 HCl and 0.13 mol L−1 FeCl3 have been used as leaching solution of industrially wasted copper at room temperature. Copper recovery from the leaching solution has been studied by batch electrodeposition at room temperature and either by using different constant current densities or by pulsing the current. The deposits obtained at 20 mA cm−2 show low efficiencies and are mainly composed of Cu0 with CuCl being a minor component. When the deposits are obtained at 50 mA cm−2, the efficiency is higher, but the adherence is poor and the porosity is high. By using pulsed electrodeposition, it is possible to improve the adherence of the deposits. However, the deposits are contaminated with copper and iron oxides, as well as with chloride compounds. Tin was not detected in any of the deposits obtained using all the electrodeposition conditions tested in this work.

中文翻译：

---

使用酸性氯化铁浸出和电沉积从印刷电路板中回收铜

在这项工作中，0.5 mol L-1 HCl 和0.13 mol L-1 FeCl3 作为工业废铜在室温下的浸出液。已经通过在室温下通过使用不同的恒定电流密度或通过脉冲电流进行分批电沉积来研究从浸出液中回收铜。在 20 mA cm-2 下获得的沉积物显示出低效率，主要由 CuO 组成，CuCl 是次要成分。当在50 mA cm-2下获得沉积物时，效率更高，但附着力差，孔隙率高。通过使用脉冲电沉积，可以提高沉积物的附着力。然而，这些沉积物被铜和铁的氧化物以及氯化物污染。