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Dynamic analysis of SH wave by a three-layer inclusion near interface in bi-material half space
Aip Advances ( IF 1.6 ) Pub Date : 2020-05-04 , DOI: 10.1063/1.5143595
Paeksan Jang 1 , Unyong Paek 1 , Kunchol Jong 2 , Duhon Yun 3 , Cholyong Kim 1 , Songchol Ri 4
Affiliation  

In this paper, the scattering of SH waves by a three-layer inclusion near the bi-material interface has been studied. A complex function method is employed to solve a two-dimensional wave propagation problem. The displacement fields in the bi-material half space and inside the linings of the inclusion are constructed, satisfying the governing equation, and unknown coefficients are solved from boundary conditions. The bi-material half space is separated into two quarter spaces, and the region matching method is used to determine the extra-forces on the interface. With the aid of the Green function method, the displacement fields owing to the forces are obtained. Then, the dynamic stress concentration factors (DSCFs) around the inner and outer surfaces of the inclusion are presented graphically, considering different medium parameters. Results are compared with those of earlier investigations, and the effect of parameters on the DSCF is discussed.

中文翻译:

双材料半空间中界面附近三层夹杂物对SH波的动力分析

本文研究了双材料界面附近三层夹杂物对SH波的散射。采用复函数方法解决二维波传播问题。构造双材料半空间和夹杂物内衬内部的位移场,满足控制方程,并根据边界条件求解未知系数。双材料半空间分成两个四分之一空间,并且使用区域匹配方法确定界面上的额外力。借助于格林函数方法,获得了由于力引起的位移场。然后,考虑到不同的介质参数,以图形方式显示了夹杂物内外表面周围的动态应力集中系数(DSCF)。
更新日期:2020-05-04
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