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Failure mechanism of lead-free component boards in thermomechanical test based on recrystallization enhanced cracking
Microelectronics Reliability ( IF 1.6 ) Pub Date : 2020-07-01 , DOI: 10.1016/j.microrel.2020.113623
Hongbo Xu , Fa Liu , Li Zhou , Hongyun Zhao , Mingyu Li

Abstract The purpose of this paper is to make a comprehensive understanding of the trends between the lifetime and the thermomechanical test setup parameters, based on the physical failure mechanism of SnAgCu solder interconnections in the component boards. The thermomechanical tests, including thermal cycling and thermal shock, were employed to investigate the failure of the component boards under different loading conditions. The in situ observation during the thermomechanical tests was employed to study the microstructure evolution and the crack propagation of solder interconnections. Electrical failures of the component boards under all setup conditions are mainly caused by the cracks, which propagate along the continuous network of the high-angle grain boundaries produced by the distinguished recrystallization of solder interconnections. The propagation of cracks is highly dependent on the expansion of the recrystallized volume in the solder interconnections. In addition, the expansion of the recrystallization would be influenced by the setup parameters of the thermomechanical test. The paper discusses the relationship among the four factors of the lifetime, the crack growth, the restoration phenomenon and the test setup parameters, in order to explain the complicated trend between the component board lifetime and the setup parameters.

中文翻译:

基于再结晶强化开裂的无铅元件板热机械试验失效机理

摘要 本文的目的是基于元件板中 SnAgCu 焊料互连的物理失效机制,全面了解寿命和热机械测试设置参数之间的趋势。热机械测试,包括热循环和热冲击,被用来研究组件板在不同负载条件下的故障。热机械测试过程中的原位观察被用来研究焊料互连的微观结构演变和裂纹扩展。在所有设置条件下,元件板的电气故障主要是由裂纹引起的,裂纹沿着由焊料互连的显着再结晶产生的大角度晶界的连续网络传播。裂纹的传播高度依赖于焊料互连中再结晶体积的膨胀。此外,再结晶的膨胀会受到热机械试验设置参数的影响。本文讨论了寿命、裂纹扩展、恢复现象和测试设置参数这四个因素之间的关系,以解释元件板寿命与设置参数之间的复杂趋势。
更新日期:2020-07-01
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