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High performance multilayer thin-film encapsulation for organic micro-displays by inserting in-situ plasma oxidized Al layers between SiOx layers
Applied Physics Express ( IF 2.3 ) Pub Date : 2020-05-28 , DOI: 10.35848/1882-0786/ab92ef
Houyun Qin , Chang Liu , Yiming Liu , Song Wei , Chong Peng , Mingxin Lu , Hongbo Wang , Yi Zhao

Multilayer thin-film encapsulation (TFE) plays an important role in Si-based organic micro-displays. In this letter, we demonstrate an efficient and low process-temperature approach to fabricate high-performance barrier films by inserting in-situ plasma oxidized Al layers between SiOx encapsulation layers. Calcium degradation tests show that the water vapor transmission rate (WVTR) of the SiOx/AlOx multilayer barrier film is 2.23×10-8 kgm-2day-1 under the conditions of 25 ℃ and 70% relative humidity after in-situ plasma oxidation treatment for 20 min, which is a reduction of two orders of magnitude compared with single-layer SiOx barrier films.

中文翻译:

通过在 SiOx 层之间插入原位等离子体氧化铝层,用于有机微显示器的高性能多层薄膜封装

多层薄膜封装 (TFE) 在硅基有机微显示器中发挥着重要作用。在这封信中,我们展示了一种通过在 SiOx 封装层之间插入原位等离子体氧化 Al 层来制造高性能阻挡膜的高效低工艺温度方法。钙降解试验表明,原位等离子体氧化处理后的SiOx/AlOx多层阻隔膜在25℃、70%相对湿度条件下的水蒸气透过率为2.23×10-8 kgm-2day-1 20 分钟,与单层 SiOx 阻隔膜相比减少了两个数量级。
更新日期:2020-05-28
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