Abstract

The grain boundaries in Ni–34%Cu alloy have been analyzed by emission Mössbauer spectroscopy. The mechanism of grain-boundary Co diffusion in the alloy and the grain-boundary segregation factor of this element are determined. The grain-boundary segregation of interstitial impurities is observed at low annealing temperatures.

中文翻译：

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Ni–34％Cu合金中晶界的发射穆斯堡尔光谱

摘要

Ni-34％Cu合金中的晶界已通过发射Mössbauer光谱法进行了分析。确定了合金中晶界Co扩散的机理和该元素的晶界偏析因子。在低退火温度下观察到间隙杂质的晶界偏析。