Abstract Flip chip technology has been widely used in integrated circuit packages due to its superiority of performance in various aspects. The solder joints sandwiched between chips and organic substrates, act as the mechanical and electrical connections in flip chips. However, with the trend of flip chips towards ultra-fine pitch and high density, and the new requirements of encapsulation materials, the solder joints are more likely to suffer from the defects of cracks, voids, balls missing. These defects affect the performance and service life of flip chips and result in false alarms. Solder joint defects can be detected using both contact and non-contact ways, and non-contact testing methods have proven to be more successful than contact methods for detecting the solder joint defects. This review emphasizes the main results of research in the field of solder joints defect inspection approaches and clarifies the principle of the methods as well as the corresponding advantages and disadvantages.

中文翻译：

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基于无损检测的倒装芯片焊点缺陷检测：综述

摘要 倒装芯片技术因其在各方面性能的优越性，在集成电路封装中得到了广泛的应用。夹在芯片和有机基板之间的焊点充当倒装芯片中的机械和电气连接。然而，随着倒装芯片向超细间距和高密度的趋势，以及对封装材料的新要求，焊点更容易出现裂纹、空洞、漏球等缺陷。这些缺陷会影响倒装芯片的性能和使用寿命并导致误报。焊点缺陷可以使用接触和非接触两种方式检测，并且非接触测试方法已被证明比接触方法更成功地检测焊点缺陷。