The flow behavior of an Al-Cu-Li-Mg-Ag alloy was studied by thermal simulation tests at deformation temperatures between 350 °C and 470 °C and strain rates between 0.01–10 s⁻¹. The microstructures of the deformed materials were characterized by electron backscattered diffraction. Constitutive equations were developed after considering compensation for strains. The processing maps were established and the optimum processing window was identified. The experimental data and predicted values of flow stresses were in a good agreement with each other. The influence of deformation temperature and strain rates on the microstructure were discussed. The relationship between the recrystallization mechanism and the Zener–Hollomon parameter was investigated as well.

中文翻译：

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Al-Cu-Li-Mg-Ag合金的热变形行为和组织表征

通过热模拟试验研究了Al-Cu-Li-Mg-Ag合金在350°C至470°C的变形温度和0.01-10 s ^-1的应变速率下的流动行为。通过电子反向散射衍射表征了变形材料的微观结构。本构方程是在考虑了应变补偿后建立的。建立处理图并确定最佳处理窗口。流变应力的实验数据和预测值彼此吻合良好。讨论了变形温度和应变速率对显微组织的影响。还研究了重结晶机理与齐纳-所罗门参数之间的关系。