Abstract Nano-Cu-based materials have many applications in the microelectronics and aerospace industries, which not only maintain the advantages of copper materials, but also make up for the shortage of copper. In this paper, the precursor powder of silica-reinforced copper matrix composites was prepared by chemical coprecipitation method, which main ingredients are Cu4SO4(OH)6 and SiO2. The precursor powder was reduced by hydrogen in 450 °C for 4 h to obtain SiO2-Cu composite powder, and then treated by cold press pressing and solid phase high temperature sintering to obtain nano-silica copper matrix composite. The results show that that the reinforcing phase and matrix are mutually dispersed in the process of coprecipitation, and the composite gains more homogeneous size and higher hardness as the dispersion effect of reinforcement on the copper matrix achieves the best.

中文翻译：

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化学共沉淀法均匀分散纳米SiO2颗粒增强铜基体

摘要 纳米铜基材料在微电子、航空航天等领域有着广泛的应用，既保持了铜材料的优势，又弥补了铜的不足。本文采用化学共沉淀法制备了二氧化硅增强铜基复合材料的前驱体粉体，其主要成分为Cu4SO4(OH)6和SiO2。前驱体粉末在450 ℃下氢气还原4 h得到SiO2-Cu复合粉末，然后通过冷压压制和固相高温烧结处理得到纳米二氧化硅铜基复合材料。结果表明，增强相和基体在共沉淀过程中相互分散，