The field of electronic device applications is becoming more and more extensive. With the development of science and technology and the improvement of the integration of electronic components, local heating is becoming more and more serious. If heat cannot be discharged immediately, it will cause heat to accumulate, causing the temperature of each component to exceed the limit. The reliability of electronic equipment is greatly reduced. Especially in important fields such as military and aerospace, the thermal reliability of electronic components is higher. The research results show that increasing the Reynolds number is helpful to reduce the overall temperature and thermal resistance of the heat sink, but the increase of the Reynolds number and the decrease of the thermal resistance value are gradually flat. The design concept of material reduction has a significant impact on processing and cost. The results of this article show that selecting the appropriate heat sink fins and matching the specific Reynolds number can effectively improve the heat transfer performance of the heat sink.

电子设备应用领域变得越来越广泛。随着科学技术的发展和电子元件集成度的提高，局部供暖变得越来越严重。如果不能立即散热，则会导致热量积聚，从而使每个组件的温度超过极限。电子设备的可靠性大大降低。特别是在军事和航空航天等重要领域，电子组件的热可靠性更高。研究结果表明，增加雷诺数有助于降低散热器的整体温度和热阻，但雷诺数的增加和热阻值的减少逐渐趋于平稳。减少材料的设计理念对加工和成本有重大影响。本文的结果表明，选择合适的散热片并匹配特定的雷诺数可以有效地提高散热器的传热性能。