当前位置: X-MOL 学术Microelectron. Reliab. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
In-situ service load monitoring of automotive electronic systems using silicon-based piezoresistive stress sensor
Microelectronics Reliability ( IF 1.6 ) Pub Date : 2020-07-01 , DOI: 10.1016/j.microrel.2020.113650
Yu-Hsiang Yang , Bongtae Han , Alexandru Prisacaru , Przemyslaw Gromala , Shengbing Jiang , Azeem Sarwar

Abstract It is expected that more and more complex (integrated) automotive electronics will be adopted in systems. These advanced electronics are critical for passenger safety. Documenting the in-situ loading is, thus, very important for accurate reliability prognostics. In this study, we propose a piezoresistive stress sensor to detect the in-situ loading of an automotive electronic control unit (ECU). A load metric directly related to the in-situ loading is defined by considering the in-situ stress values of twelve measurement cells in each sensor. The sensor and the proposed load metric are implemented to document the in-situ loading that results from the local coefficient of thermal expansion mismatch between the electrical components and printed circuit board (PCB) in advanced ECUs. The validity of the proposed metric is corroborated by failure analysis of solder joints of multilayer ceramic capacitors (MLCCs).

中文翻译:

使用硅基压阻应力传感器对汽车电子系统进行现场服务负载监测

摘要 预计越来越多的复杂(集成)汽车电子将被应用于系统中。这些先进的电子设备对乘客安全至关重要。因此,记录原位载荷对于准确的可靠性预测非常重要。在这项研究中,我们提出了一种压阻式应力传感器来检测汽车电子控制单元 (ECU) 的原位负载。通过考虑每个传感器中十二个测量单元的原位应力值来定义与原位载荷直接相关的载荷度量。实施传感器和建议的负载度量以记录由高级 ECU 中电子元件和印刷电路板 (PCB) 之间的局部热膨胀系数不匹配导致的原位负载。
更新日期:2020-07-01
down
wechat
bug