Multilayer interconnections are needed for microdevices with a large number of independent electrodes. A multi-level photolithographic process is commonly employed to provide multilayer interconnections in integrated circuit devices, but it is often too expensive for large-area or disposable devices frequently needed for microfluidics. The printed circuit board (PCB) can provide multilayer interconnection at low cost, but its rough topography poses a challenge for small droplets to slide over. Here we report a low-cost fabrication of low-topography multilayer interconnects by selective and controlled anodization of thin-film metal layers. The process utilizes anodization of metal (tantalum in this paper) or, more specifically, repetitions of a partial anodization to form insulation layers between conductive layers and a full anodization to form isolating regions between electrodes, replacing the usual process of depositing, planarizing, and etching insulation layers. After verif...

中文翻译：

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用于微流体装置的多层互连的低成本和低形貌制造

具有大量独立电极的微型设备需要多层互连。通常采用多层光刻工艺来提供集成电路器件中的多层互连，但是对于微流体学经常需要的大面积或一次性器件而言，这通常过于昂贵。印刷电路板（PCB）可以以低成本提供多层互连，但是其粗糙的地形给小液滴滑过带来了挑战。在这里，我们报告了通过对薄膜金属层进行选择性和受控阳极氧化的低成本制造低形貌多层互连的方法。该工艺利用金属（本文中的钽）进行阳极氧化，或更具体地说，重复进行部分阳极氧化以在导电层之间形成绝缘层，并进行完全阳极氧化以在电极之间形成隔离区域，从而替代了沉积，平坦化和蚀刻绝缘层的常规过程。经过验证...