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XPS analysis and electrical conduction mechanisms of atomic layer deposition grown Ta2O5thin films onto p-Si substrates
Journal of Vacuum Science & Technology A ( IF 2.9 ) Pub Date : 2020-03-13 , DOI: 10.1116/1.5134764
Spyridon Korkos 1 , Nikolaos J. Xanthopoulos 1 , Martha A. Botzakaki 1 , Charalampos Drivas 2 , Styliani Kennou 2 , Spyridon Ladas 2 , Anastasios Travlos 3 , Stavroula N. Georga 1 , Christoforos A. Krontiras 1
Affiliation  

Metal oxide semiconductor capacitors that incorporate tantalum pentoxide (Ta2O5) thin films as dielectric were fabricated via the atomic layer deposition (ALD) technique and characterized through TEM, XPS, C–V, and I–V measurements. TEM analysis revealed the amorphous phase of Ta2O5 films and the existence of an ultrathin SiOx layer in the Ta2O5/p-Si interface, also evidenced by XPS spectra. XPS analysis verified the stoichiometry of the ALD-deposited Ta2O5 films. Furthermore, XPS results indicate values of 2.5 and 0.7 eV for the conduction and valence band offsets of the Ta2O5/p-Si interface, respectively. I–V measurements, for positive and negative applied bias voltages, reveal that the conduction is governed by Ohmic, trap controlled space charge limited, and Schottky mechanisms depending on the applied voltage and temperature region. Through the analysis of Schottky emission data, the conduction band offset of Ta2O5/p-Si (φΒ) is calculated to be 0.6 eV, while the valence band offset is 2.6 eV, in very good agreement with the XPS results. The energy band diagram of Ta2O5/p-Si is constructed.

中文翻译:

原子层沉积在p-Si衬底上生长的Ta2O5薄膜的XPS分析和导电机理

掺入五氧化二钽(Ta金属氧化物半导体电容器2 ö 5)薄膜作为电介质分别经由原子层沉积(ALD)技术制造和表征通过TEM,XPS,C-VI-V测量。TEM分析表明,Ta 2 O 5膜为非晶相,并且在Ta 2 O 5 / p-Si界面中存在超薄SiO x层,这也由XPS光谱证明。XPS分析验证了ALD沉积Ta 2 O 5的化学计量电影。此外,XPS结果表明Ta 2 O 5 / p-Si界面的导带和价带偏移分别为2.5和0.7 eV 。对正,负外加偏置电压进行的I–V测量表明,传导受欧姆力,陷阱控制的空间电荷限制和肖特基机制控制,具体取决于所施加的电压和温度范围。通过肖特基发射数据的分析,所述导带的Ta的偏移2 ö 5 / p型硅(φ Β)被计算为0.6电子伏特,而价带偏移为2.6电子伏特,与XPS结果非常一致。Ta 2 O 5的能带图/ p-Si已构建。
更新日期:2020-03-13
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