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Impact of interface materials on side permeation in indirect encapsulation of organic electronics
Journal of Vacuum Science & Technology A ( IF 2.9 ) Pub Date : 2020-03-12 , DOI: 10.1116/1.5140665
Ankit Kumar Singh 1, 2 , Wen-Fang Chou 3 , Xiaojia Jia 3 , Cheng-Yin Wang 3 , Canek Fuentes-Hernandez 3 , Bernard Kippelen 3 , Samuel Graham 1, 2
Affiliation  

This work demonstrates the impact of the contact interface between barrier films and adhesives on the side permeation of moisture into packaged devices. When barrier films are brought into contact with the adhesive layer during indirect encapsulation, permeation along defects at this interface can occur due to the imperfect nature of contact, resulting in the formation of pores. The connected network of pores can act as capillaries and be an alternative pathway for water permeation as opposed to the bulk of the adhesive or edge seal materials used for barrier attachment to the package. The rate of water permeation through the capillaries is governed by surface energies of the materials at the interfaces. Experimental results demonstrate that the rate of water permeation is significantly lowered by using materials with higher contact angles at the interface.

中文翻译:

界面材料对有机电子器件间接封装中侧面渗透的影响

这项工作证明了隔离膜和胶粘剂之间的接触界面对水分渗入已包装设备的侧面的影响。当在间接封装过程中使阻挡膜与粘合剂层接触时,由于接触的不完美性质,会在该界面处沿缺陷渗透,从而导致孔的形成。连通的孔网络可以充当毛细管,并且可以作为水渗透的替代途径,这与用于将障碍物附着到包装上的大量粘合剂或边缘密封材料相反。通过毛细管的水渗透速率取决于界面处材料的表面能。
更新日期:2020-03-12
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