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Topology optimization for unifying deposit thickness in electroplating process
Structural and Multidisciplinary Optimization ( IF 3.9 ) Pub Date : 2020-05-13 , DOI: 10.1007/s00158-020-02574-8
Naoko Ishizuka , Takayuki Yamada , Kazuhiro Izui , Shinji Nishiwaki

Uniformity of deposited thickness in electroplating processes is vital to the realization of desirable surface qualities in many products. The thickness distribution of deposits is affected by numerous factors, such as the arrangement and shapes of auxiliary cathodes, anodes, and shields as well as the detailed configuration of the electroplating process. Deposit thickness reflects the amount of ions transported from anodes to cathodes, particularly to the object being plated, although auxiliary cathodes are sometimes placed to prevent excess plating in certain areas of the product, as are shields that impede current flow. This study presents a topology optimization method for achieving uniform deposition thickness, applied to the design of anodes placed in an electroplating bath. The proposed method is based on level set–based topology optimization and FEM is used to analyze the electrochemical field. The shapes and arrangement of anodes are expressed with respect to ion sources using level set functions. The uniformity of the current density on a cathode is employed as an objective function, since current density is nearly proportional to the thickness of the resulting electroplating. To stabilize the optimization process, the Kreisselmeier–Steinhauser function is used. The magnitude of the current density on the cathode is set as a constraint so that it does not fall below a certain value, to avoid lengthy plating times that would occur if the current density were too low. Numerical examples are presented to confirm the utility of the proposed method and the results demonstrate that the proposed method can obtain appropriate shapes and arrangements of anodes.



中文翻译:

拓扑优化,可在电镀过程中统一沉积厚度

电镀工艺中沉积厚度的均匀性对于实现许多产品中理想的表面质量至关重要。沉积物的厚度分布受许多因素影响,例如辅助阴极,阳极和屏蔽的布置和形状以及电镀过程的详细配置。沉积物的厚度反映了从阳极到阴极,特别是到被镀物体的离子迁移量,尽管有时会放置辅助阴极以防止在产品的某些区域出现过多的镀层,因为屏蔽层会阻碍电流流动。这项研究提出了一种用于实现均匀沉积厚度的拓扑优化方法,该方法适用于放置在电镀浴中的阳极设计。所提出的方法基于基于水平集的拓扑优化,并且使用有限元法分析电化学场。阳极的形状和排列是使用能级设置函数相对于离子源表示的。阴极上电流密度的均匀性被用作目标函数,因为电流密度几乎与所得电镀的厚度成比例。为了稳定优化过程,使用了Kreisselmeier–Steinhauser函数。将阴极上的电流密度的大小设置为限制条件,以使其不会低于某个特定值,以避免电流密度太低时发生的电镀时间过长。

更新日期:2020-05-13
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