The structure and mechanical properties of different-thickness copper foils obtained by chemical and electrochemical deposition at high and low temperatures are studied. The activation energy and the driving force of the recrystallization are determined.

中文翻译：

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温度对细晶粒铜箔结构和性能的影响

研究了化学和电化学沉积得到的不同厚度铜箔在高温和低温下的结构和力学性能。确定了再结晶的活化能和驱动力。