The thermal conductivity of AlSi10Mg made by laser powder bed fusion (LPBF), and its modification via heat treatment, has received little attention despite possible applications for heat exchangers and thermo-mechanical components. Here, we show that heat treatment can increase the thermal conductivity of LPBF AlSi10Mg to that of cast material. Our results indicate that post-manufacture annealing eliminates the thermal conductivity anisotropy present in the as-built condition, and enhances the conductivity by close to 30 % in the transverse direction (perpendicular to the LPBF build orientation). A solution heat treatment increases the thermal conductivity further still (36 % compared to the as-built condition), while a T6-like treatment provides the greatest increase (44 % compared to the as-built condition). These improvements are related to the evolution of the AlSi10Mg microstructure, especially the breakdown of the Si cellular structure. Additionally, the thermal conductivities of gyroid lattice structures were examined in the as-built and annealed conditions. Contrary to solid specimens, the lattice structures exhibited almost isotropic thermal conductivity in the as-built condition. Their thermal conductivities were increased by the annealing treatment in proportion to their volume fraction. Our findings contribute to the development of a general design-for-additive-manufacturing (DfAM) framework which will make the best possible use of AM materials and lattice structures for heat transfer components.

尽管可能在热交换器和热机械部件中使用，但通过激光粉末床熔合（LPBF）制成的AlSi10Mg的导热性及其通过热处理的改性几乎没有引起注意。在这里，我们表明热处理可以提高LPBF AlSi10Mg的热导率到铸造材料的热导率。我们的结果表明，制造后退火消除了在建成状态下存在的热导率各向异性，并在横向方向（垂直于LPBF构造方向）上将电导率提高了近30％。固溶热处理进一步提高了热导率（与正常状态相比为36％），而类似T6的处理提供了最大的增加（与正常状态相比为44％）。这些改进与AlSi10Mg微观结构的演变有关，特别是与Si胞结构的破坏有关。另外，在建成和退火条件下检查了螺旋状晶格结构的热导率。与固体样品相反，晶格结构在建成时表现出几乎各向同性的热导率。通过退火处理，它们的热导率与它们的体积分数成比例地增加。我们的发现为通用制造设计（DfAM）框架的发展做出了贡献，该框架将最大可能地利用AM材料和晶格结构作为传热组件。在建成和退火条件下检查了回旋晶格结构的热导率。与固体样品相反，晶格结构在建成时表现出几乎各向同性的热导率。通过退火处理，它们的热导率与它们的体积分数成比例地增加。我们的发现为通用制造设计（DfAM）框架的发展做出了贡献，该框架将最大可能地利用AM材料和晶格结构作为传热组件。在建成和退火条件下检查了回旋晶格结构的热导率。与固体样品相反，晶格结构在建成时表现出几乎各向同性的热导率。通过退火处理，它们的热导率与它们的体积分数成比例地增加。我们的发现为通用制造设计（DfAM）框架的发展做出了贡献，该框架将最大可能地利用AM材料和晶格结构作为传热组件。通过退火处理，它们的热导率与它们的体积分数成比例地增加。我们的发现为通用制造设计（DfAM）框架的发展做出了贡献，该框架将最大可能地利用AM材料和晶格结构作为传热组件。通过退火处理，它们的热导率与它们的体积分数成比例地增加。我们的发现为通用制造设计（DfAM）框架的发展做出了贡献，该框架将最大可能地利用AM材料和晶格结构作为传热组件。