Abstract In this paper, we introduce a level set topology optimization formulation considering coupled mechanical and thermal loads. Examples considering stress and compliance minimization under temperature and volume constraints, and mass minimization under stress and temperature constraints, are presented. The p-norm of the stress field and temperature field is used to approximate the maximum stress and temperature, respectively. We show that the minimal compliant topologies under temperature constraints do not necessarily have low stress values, and the stress and temperature requirements can be conflicting. The results also show that designs obtained by ignoring the thermal or structural constraints can result in high values of temperature or stress, respectively, thus demonstrating the importance of using a coupled multi-physics model in the optimization.

中文翻译：

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应力和温度约束下结构的水平集拓扑优化

摘要 在本文中，我们介绍了一种考虑耦合机械和热载荷的水平集拓扑优化公式。给出了在温度和体积约束下考虑应力和柔量最小化以及在应力和温度约束下质量最小化的示例。应力场和温度场的 p 范数分别用于近似最大应力和温度。我们表明，在温度约束下的最小顺从拓扑不一定具有低应力值，并且应力和温度要求可能相互冲突。结果还表明，通过忽略热或结构约束获得的设计可能会分别导致较高的温度或应力值，