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Surface‐mount bowtie antenna element for millimeter‐wave applications
Microwave and Optical Technology Letters ( IF 1.5 ) Pub Date : 2020-05-06 , DOI: 10.1002/mop.32430
Xiubo Liu 1 , Wei Zhang 1 , Dongning Hao 1 , Yanyan Liu 2
Affiliation  

A surface‐mount bowtie antenna element with a ball grid array (BGA) packaging is proposed. Compared to a two‐dimensional end‐fire antenna, the proposed surface‐mount antenna element is a discrete three‐dimensional structure for obtaining a broadside radiation pattern. The proposed antenna element is mounted on the motherboard and fed by the balun located at the bottom layer of the motherboard to obtain a wide impedance bandwidth. In addition, the proposed antenna with the BGA packaging provides a cost‐effective solution for integration with surface‐mount devices on the same system board. The performance of the antenna prototype was verified by measurements.

中文翻译:

用于毫米波应用的表面安装领结天线元件

提出了一种采用球栅阵列(BGA)封装的表面安装领结天线元件。与二维端射天线相比,拟议的表面安装天线元件是用于获得宽边辐射方向图的离散三维结构。拟议的天线元件安装在主板上,并由位于主板底层的不平衡变压器馈电,以获得宽阻抗带宽。此外,建议的带有BGA封装的天线为与同一系统板上的表面安装设备集成提供了一种经济高效的解决方案。通过测量验证了天线原型的性能。
更新日期:2020-05-06
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