Abstract In this study, Cu wire-Al bond pad (Cu Al) samples were produced by means of Thermosonic wire bonding technique. Both IMC and ball shear strength were assessed for samples produced with different bonding temperatures, HTS duration and forming gas supply. The experiments were carried out using Taguchi and conventional “one parameter at a time” approaches. For Taguchi method, experiment was managed with L9 orthogonal array for optimizing the wire bonding process. It was observed that the process was optimized with forming gas supply ON, bonding temperature of 400 °C and after 1000 h of HTS treatment. This was achieved by a continuous and uniform growth of the IMC across the bonding interface. As for experiment based on “one parameter at a time” approach, a linear proportionality between IMC thickness and ball shear strength was observed. This indicated no void formation at the bonding interface of the sample. In addition, with increased number of run in this experiment, the regression analysis involving interaction of factors was allowed. The measurements' data was found to fit better in the additive model including the interaction of factors. Besides, an additional model based on the fundamental IMC growth behaviour with regards to the bonding temperature and HTS duration was proposed. Regression analysis of this model showed an agreement with measurement data.

中文翻译：

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热超声铜铝互连力学和微观结构特性的统计分析

摘要 在本研究中，采用热超声引线键合技术制备了铜线-铝键合焊盘 (Cu Al) 样品。对使用不同接合温度、HTS 持续时间和合成气体供应生产的样品评估 IMC 和球剪切强度。实验是使用田口和传统的“一次一个参数”方法进行的。对于田口方法，使用 L9 正交阵列管理实验以优化引线键合工艺。据观察，该工艺在开启成形气体、400 °C 的接合温度和 1000 小时的 HTS 处理后进行了优化。这是通过 IMC 在键合界面上连续均匀生长来实现的。对于基于“一次一个参数”方法的实验，观察到 IMC 厚度和球剪切强度之间的线性比例关系。这表明在样品的结合界面没有形成空隙。此外，随着本实验运行次数的增加，允许进行涉及因素相互作用的回归分析。发现测量数据更适合加性模型，包括因素的相互作用。此外，还提出了基于基本 IMC 生长行为与键合温度和 HTS 持续时间相关的附加模型。该模型的回归分析表明与测量数据一致。提出了基于与键合温度和 HTS 持续时间相关的基本 IMC 生长行为的附加模型。该模型的回归分析表明与测量数据一致。提出了基于与键合温度和 HTS 持续时间相关的基本 IMC 生长行为的附加模型。该模型的回归分析表明与测量数据一致。